MEMS and Sensor Solutions

The M Series test system offers low-cost characterization and production testing of Sensor and MEM's devices. Typically, both MEMS and Sensor device markets require a more custom engineered solution. KVD has experience in designing and manufacturing:

• LED based light sources
• Dark cabinets
• Closed loop calibration circuits
• Thermal monitoring circuits
• Local high speed ADC conversion
• Mechanical fixturing for unique sockets and packages

MEMS

Micro electromechanical systems ( MEMS ) typically need all the power of a Mixed Signal test system, despite their small pin counts and simple block structures. The process of MEMS manufacturing and assembly requires complex algorithmic trimming during the test process. The KVD is well suited for this task.

KVD MEMS test solution:

• AC source and digitizers for frequency analysis
• Digital pins for register control / clocking and servo based trimming
• Timing access via the digital or directly for switch time, frequency, prop delay, rise and fall time
• VI's for power supplies, dynamic loads, bias pins, and power
• High Speed Data link increases data bandwidth for trimming searches

Image Sensors

A robust precision optical source is integrated with the tester and may be fixtured to a variety of probers and handlers. This illuminator includes a precision light sensor near the device under test (DUT) so true illumination level is always known. We use the High Speed Link in the M Series test head as a frame grabber. This permits high data rate capture and processing of digital or analog pixel data from the CIS.

Typical CMOS Image Sensor Tests:

Electrical Tests

• Continuity Tests on all pins to determine connectivity
• Leakage Tests on input lines to ensure device interoperability
• Current Tests on power supply pins to ensure the device is drawing proper current
• Functional Tests exercise clocking, image synchronization, and control interface registers to ensure the device reads and acts on instructions
• A/D Converter Tests - measure step size, linearity, and total harmonic distortion for CIS devices with integrated A/D converter

Optical Tests

• Frame Mean and Sigma pixel values averaged over the entire image; the standard deviation of pixel values over the entire image
• Pixel Mean and Sigma multiple dark, white, and color frames are captured, calculating mean and sigma for each individual pixel
• Row and Column Gains pixel values are averaged for each row and column respectively
• Uniformity of Pixel Response regions of pixels distributed over the entire frame are averaged and examined for variability

Bayer Pattern Graph Raw digital data from a CMOS imager device, tested by the M Series, showing Bayer color pattern and defective pixel region.

Please contact our KVD application team to discuss your test needs.